发明名称 PRESSURE REDUCING-TYPE PACKAGE SOCKET, ESPECIALLY IN RELATION TO A TEST SOCKET FOR A BALL GRID ARRAY(BGA) PACKAGE
摘要 PURPOSE: A pressure reducing-type package socket is provided to stably contact a packet with socket pins by using an air pressure difference between the inside and the outside of the socket, thereby increasing efficiency of a packet test socket. CONSTITUTION: Side supports(2) fix a package(3). Socket pins(9) are used for contacting with package balls(4). A fixing plate(7) fixes the socket pins(9). Fixing screws(6) connect the fixing plate(7) with a lower plate(5). A pressure reducing motor(11) discharges an internal socket air. A tube(10) is connected with the pressure reducing motor(11). Air holes(13) are formed between the socket pins(9). An empty space(12) of a socket is connected under the air holes(13), so that the internal socket air is discharged outside through the pressure reducing motor(11) and the tube(10).
申请公布号 KR20040098672(A) 申请公布日期 2004.11.26
申请号 KR20030030882 申请日期 2003.05.15
申请人 LG ELECTRONICS INC. 发明人 KIM, SANG JIN
分类号 H01R33/76;(IPC1-7):H01R33/76 主分类号 H01R33/76
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