Heat dissipation structure

摘要

A heat dissipation structure includes a heat-producing electronic component on a substrate, a thermally conductive case, and grease. The electronic component and the substrate are housed in the case. The grease is provided between the case and the electronic component or the substrate for transmitting heat produced by the electronic component to the case. The case has contact surfaces that contact with the grease. The contact surfaces have free energy equal to or higher than 20 mN/m and roughness equal to or larger than 1.0 mum.