| 摘要 |
PROBLEM TO BE SOLVED: To obtain a hardenable epoxy resin composition for semiconductor encapsulation containing a crystallized epoxy resin which is easy to mix with a hardener, or the like. SOLUTION: This hardenable epoxy resin composition for semiconductor encapsulation essentially contains a crystallized epoxy resin derived from 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin and has a value of not less than 1.03 for a ratio of the amount of endotherm between 50°C and 130°C measured using a DSC apparatus at the temperarure-raising rate of 10°C per minute and that between 80°C and 125°C, and a hardener for epoxy resins. COPYRIGHT: (C)2005,JPO&NCIPI
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