发明名称 |
CAM DATA PREPARING METHOD FOR ELECTRONIC CIRCUIT BOARD, CAD/CAM SYSTEM FOR ELECTRONIC CIRCUIT BOARD, COMPUTER PROGRAM USED THEREFOR, AND MANUFACTURING METHOD FOR ELECTRONIC CIRCUIT BOARD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a CAM data preparing method for an electronic circuit board capable of converting a CAD data reflected with each inside diameter of each opening of a solder resist layer exactly and efficiently into a CAM data comprising each inside diameter D' of each opening of an exposure mask for photolithography for forming the opening. <P>SOLUTION: The each opening inside diameter D' of the solder resist layer reflected on the CAD data is converted as the CAM data into a mask pattern D<SB>0</SB>for the openings of the exposure mask for the photolithography to form the openings of a solder resist layer by a photolithographic process using a photosensitive resin. A ratio D<SB>0</SB>/D' of the mask pattern D<SB>0</SB>for the each opening to the each opening inside diameter D' is corrected in response to the density of the plurality of openings distributed in a plane of the solder resist layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2004334344(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030125966 |
申请日期 |
2003.04.30 |
申请人 |
NGK SPARK PLUG CO LTD |
发明人 |
ONO TOMOSHIGE;YOKOI KENJI;OHASHI HATSUO |
分类号 |
G03F1/68;G03F1/70;G06F17/50;H05K3/00;(IPC1-7):G06F17/50;G03F1/08 |
主分类号 |
G03F1/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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