发明名称 LATENT HEAT COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure, effectively lowering the outer surface temperature of a structure, and lowering the peripheral air temperature of the structure. SOLUTION: A latent heat storage material transferred in phase at a designated temperature is disposed in the lower part of the outer surface part of a structure to constitute a latent head cooling structure. When the temperature of the outer surface of the structure is raised due to insolation, the latent heat storage material disposed in the lower part of the outer surface absorbs heat to restrain a temperature rise, and heating quantity is largely absorbed at a designated temperature by latent heat. Accordingly, the outer surface temperature of a target road or a building is kept low to prevent heat island. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004332945(A) 申请公布日期 2004.11.25
申请号 JP20030124820 申请日期 2003.04.30
申请人 TAKENAKA KOMUTEN CO LTD 发明人 MITSUSAKA IKUMASA;KUROKI TOMOHIRO;ISHIKAWA YUKIO;MIWA TAKASHI
分类号 E01C11/24;F25D9/00;F28D20/02;(IPC1-7):F25D9/00 主分类号 E01C11/24
代理机构 代理人
主权项
地址