| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve a semiconductor package having a laminated structure in production efficiency. <P>SOLUTION: A frame board 1 is mounted with a semiconductor chip 3a and semiconductor packages PK11 and PK12 positioned over the semiconductor chip 3a, and mounted with a semiconductor chip 3b and semiconductor packages PK21 and PK22 positioned over the semiconductor chip 3b. The frame board 1 is cut at the center into two semiconductor packages which are mounted with the semiconductor chip 3a and the semiconductor packages PK11 and PK12 positioned over the semiconductor chip 3a, and mounted with the semiconductor chip 3b and the semiconductor packages PK21 and PK22 positioned over the semiconductor chip 3b respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
