发明名称 MANUFACTURING METHOD FOR FLEXIBLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a technology which forms a micro metal bump on a flexible substrate accurately. SOLUTION: The manufacturing method for the flexible substrate grows the metal bump 16 by using a mask film 13 patterned by a photolithography process. As an opening is not formed in a polyimide film by using a laser light, the micro opening is formed accurately, and as a result the micro metal bump 16 is formed accurately. After the metal bump 16 is formed, the mask film 13 is removed, a liquid resin raw material is coated, a coat is formed by drying it, and then a resin film is obtained by curing it. A tip portion of the metal bump 16 is exposed if a surface portion is etched at the coating step. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004336072(A) 申请公布日期 2004.11.25
申请号 JP20040208476 申请日期 2004.07.15
申请人 SONY CHEM CORP 发明人 KURITA HIDEYUKI;HISHINUMA HIROYUKI;ITO AKIRA;NAKAMURA MASAYUKI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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