| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation-film-like adhesive which enables an electronic component to be covered with an adhesive film uniform in thickness and having adhesiveness, light-screening properties, insulation properties, and high elasticity and which enables a small-sized high-density semiconductor package to be produced. SOLUTION: The adhesive film for covering electronic components is prepared from a material essentially containing (A) an epoxy resin, (B) a phenoxy resin, (C) an epoxy resin curing agent, (D) silica, and (E) carbon black, the content of (D) silica being 50-80 wt.% and the amount of (E) carbon black contained is 0.5-10 pts.wt. based on 100 pts.wt. sum of ingredients other than (D) silica and (E) carbon black. The thickness range of the film is 10-300μm. COPYRIGHT: (C)2005,JPO&NCIPI
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