| 摘要 |
PROBLEM TO BE SOLVED: To ensure a wide band characteristic and eliminate hindrance against miniaturization. SOLUTION: In the laminate chip balun element, a section U constructing an unbalanced transmission line, and sections B1, B2 constructing first and second unbalanced transmission lines located at upper and lower portions of the section U and coupled electromagnetically to each other, are embedded in lamination in a dielectric chip. Both balanced transmission lines comprise two strip lines connected to each other in lamination. The unbalanced transmission line comprises a first strip line 11 connected to an unbalanced signal terminal, and a second strip line 12 connected to the first strip line and having the other end opened. The first balanced transmission line comprises a third strip line 13 connected to a balanced signal terminal, and a fourth strip line 14 connected to the third strip line and having the other terminal connected to ground. The second balanced transmission line comprises a fifth strip line 15 connected to the balanced signal terminal, and a sixth strip line 16 connected to the fifth strip line and having the other end connected to ground. COPYRIGHT: (C)2005,JPO&NCIPI
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