CIRCUIT FORMATION SUBSTRATE MANUFACTURING METHOD AND CIRCUIT FORMATION SUBSTRATE MATERIAL

摘要

In a circuit formation substrate manufacturing method, a first sheet is sent in a second direction matched with a first direction of the first sheet. While the first sheet is sent in a third direction vertical to the first direction of the first sheet, a film is attached onto the both surfaces of the first sheet. With this method, it is possible to ensure electrical connection between the layers of the circuit formation substrate by a connection member such as a conductive paste.