| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma resistant member which can be used without performing polishing even after thermal spraying, has reduced pores and low dielectric loss and can suitably be used for semiconductor fabrication equipment or for liquid crystal-plasma display fabrication equipment, and to provide its production method. <P>SOLUTION: The plasma resistant member is obtained by forming an oxide sprayed coating comprising Y, Gd, Tb, Dy, Ho or Er on an aluminum alloy or on a base material of an aluminum alloy or obtained by subjecting an aluminum alloy to anode oxidation working. The adhesive strength between the sprayed coating and the base material is ≥20 MPa, the micro-Vickers hardness is ≥450 kgf/mm<SP>2</SP>, the surface roughness in a thermal-sprayed state is ≤5 μm by Ra and ≤35 μm by Rmax, the dielectric break down strength is ≥25 kV/mm, and the dielectric dissipation factor (tanδ) in 1 MHz to 1 GHz is ≤8×10<SP>-3</SP>. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
