BUILD-UP PRINTED CIRCUIT BOARD WITH STACK TYPE VIA HOLE, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, which has a stacked micro via hole formed for inter-layer connections of the multilayer printed wiring board and also has the via hole filled with fillers such as a liquid resin or conductive paste by using a screen of a general screen printing machine, and its manufacturing method. SOLUTION: The printed wiring board with the stacked via hole is manufactured by repeatedly performing the stages of: (1) forming a 1st via hole in a 1st copper clad plate; (2) forming a 1st plating layer where the 1st via hole is formed; (3) filling the 1st plated via hole with a filler; (4) polishing and flattening the top of the 1st via hole filled with the filler; (5) forming a 2nd plating layer covering the top of the filled via hole; and (6) laminating a 2nd copper clad plate on the 2nd plating layer. COPYRIGHT: (C)2005,JPO&NCIPI