| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mirror finishing apparatus which maximizes the working efficiency and manufacturing quality of mirror finishing, and further minimizes the consumption of polishing slurry or make the polishing slurry unnecessary, even in a CMP apparatus using the polishing slurry, by keeping a mechanochemical mirror finish grinding stone in the state where the grinding stone has been slightly wetted from the completely dry state. <P>SOLUTION: The mirror finishing apparatus comprises a wetness control means for controlling the wetness of at least either of the polishing surface of the grinding stone and the surface of a workpiece to be polished. The wetness control means comprises a sliding load monitoring means for monitoring the sliding load of the polishing means, a critical state detecting means for detecting the state where the sliding load to be monitored by the sliding load monitoring means fluctuates unstably; and a control means for setting and keeping the wetness, which is in the optimum state neighboring the critical state detected by the critical state detecting means and slightly exceeds the wetness in the critical state. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
