METHOD FOR PREPARING CAM DATA FOR ELECTRONIC CIRCUIT BOARD, CAD/CAM SYSTEM FOR ELECTRONIC CIRCUIT BOARD AND COMPUTER PROGRAM FOR USE THEREIN, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for preparing CAM data for an electronic circuit board in which the CAD data of a board element reflecting the outside diameter of a solder bump to be obtained can be converted appropriately and efficiently into the CAM data consisting of the inside diameter of the opening of a solder paste coating mask used for forming a bump. SOLUTION: The outside diameter d' of a design element related to a bump, e.g. a solder land, is converted as CAD data into the inside diameter d0of the opening of a solder paste coating mask as CAM data. In the electronic circuit board, the inside diameter d0of the opening is corrected such that the ratio d0/d' of the inside diameter d0of the opening of a solder paste coating mask and the outside diameter d' of a design element related to a bump increases as the coating rate of a conductor layer facing a solder bump through a dielectric layer with the conductor decreases. COPYRIGHT: (C)2005,JPO&NCIPI