Lead frame for stacked semiconductor packages, stacked semiconductor packages using it, and fabrication method thereof

摘要

A lead frame for stacked semiconductor package is provided, which comprises a plurality of lead pins having same length, thickness, pitch and arranged to correspond to exterior leads of a semiconductor package, and a frame holding the lead pins, wherein at least one lead pin is integrally formed with an adjacent lead pin to be electrically connected and a part of the end of the lead pin is cut to be shorter that other lead pins. Additionally and/or alternatively, at least one lead pin is electrically connected with a remote lead pin through an additional lead or a lead line.