| 摘要 |
PROBLEM TO BE SOLVED: To reduce costs for manufacturing a ceramic sub-mount substrate 3 obtained by respectively forming electrode films 4 and 5 to a semiconductor laser chip 1 on its front surface and an electrode film 6 for die bonding to a heat sink 2 on its rear surface. SOLUTION: The substrate has a double-layer laminated structure consisting of non-electrolyzed NiP plated layers 4a, 5a, and 6a obtained by directly forming the electrode films 4 and 5 on the front surface of the sub-mount substrate 3 and the electrode film 6 on the rear surface as a base on the sub-mount substrate, and electroplating layers 4b, 5b and 6b plated with gold overlapped thereon. COPYRIGHT: (C)2005,JPO&NCIPI
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