METHOD OF MEASURING JOINING STRENGTH OF SOLDER OF ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a method of exactly measuring joining strength of solder in measuring joining strength of solder of an electronic part. SOLUTION: In measuring the joining strength of the solder joining portion 4 of a packaging part in which an electronic part 1 is packaged on a packaging substrate 2, bending strength of a lead 3 itself is subtracted from a measured joining strength value to obtain joining strength of the solder joining portion itself. COPYRIGHT: (C)2005,JPO&NCIPI