发明名称 LED FABRICATION VIA ION IMPLANT ISOLATION
摘要 A semiconductor light emitting diode includes a semiconductor substrate, an epitaxial layer of n-type Group III nitride on the substrate, a p-type epitaxial layer of Group III nitride on the n-type epitaxial layer and forming a p-n junction with the n-type layer, and a resistive gallium nitride region on the n-type epitaxial layer and adjacent the p-type epitaxial layer for electrically isolating portions of the p-n junction. A metal contact layer is formed on the p-type epitaxial layer. In method embodiments disclosed, the resistive gallium nitride border is formed by forming an implant mask on the p-type epitaxial region and implanting ions into portions of the p-type epitaxial region to render portions of the p-type epitaxial region semi-insulating. A photoresist mask or a sufficiently thick metal layer may be used as the implant mask.
申请公布号 WO2004102686(A1) 申请公布日期 2004.11.25
申请号 WO2004US14023 申请日期 2004.05.06
申请人 CREE, INC.;WU, YIFENG;NEGLEY, GERALD, H.;SLATER, JR., DAVID, B.;TSVETKOV, VALERI, F.;SUVOROV, ALEXANDER 发明人 WU, YIFENG;NEGLEY, GERALD, H.;SLATER, JR., DAVID, B.;TSVETKOV, VALERI, F.;SUVOROV, ALEXANDER
分类号 H01L21/00;H01L33/00;H01L33/02;H01L33/14;H01L33/32 主分类号 H01L21/00
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