发明名称 |
Method for preparing a polymer for chemical mechanical polishing |
摘要 |
The present invention is directed to a method for preparing a polymer for chemical mechanical polishing of a semiconductor substrate. The method comprises providing a thermoplastic foam substrate and exposing the substrate to an initial plasma reactant to produce a modified surface thereon. The method also includes exposing the modified surface to a secondary plasma reactant to create a grafted surface on the modified surface. An electrode temperature is maintained between about 20° C. and about 100° C. during the exposures of the substrate and the modified surface.
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申请公布号 |
US6821570(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20020218869 |
申请日期 |
2002.08.14 |
申请人 |
PSILOQUEST INC. |
发明人 |
OBENG YAW S.;YOKLEY EDWARD M. |
分类号 |
B24B37/04;B24B49/16;B24D3/26;B24D13/14;B24D18/00;B29C44/56;B29C59/14;(IPC1-7):C23C14/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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