发明名称 Thermally-conductive electrically-insulating polymer-base material
摘要 An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.
申请公布号 US6822018(B2) 申请公布日期 2004.11.23
申请号 US20020075978 申请日期 2002.02.15
申请人 DELPHI TECHNOLOGIES, INC. 发明人 CHAUDHURI ARUN K.;MYERS BRUCE A.
分类号 C08K3/08;(IPC1-7):C08K9/04;H05K7/20 主分类号 C08K3/08
代理机构 代理人
主权项
地址