APPARATUS AND METHOD FOR FABRICATING ALUMINIUM FILM WITH ORIENTATION OF 111 FOR INTEGRATED CIRCUIT DEVICE TO EMBODY DESIRED CHARACTERISTIC OF DEPOSITED MATERIAL

摘要

PURPOSE: A method for fabricating an aluminium film with orientation of 111 for an integrated circuit device to achieve a desired characteristic of a deposited material by controlling the temperature of a chuck heater. CONSTITUTION: A target(102) is prepared which includes a material to be deposited. A wafer(106) is supported on a chuck(126). The wafer is located between the target and the chuck. The material from the target is deposited on the wafer according to the particles colliding with the target. The temperature of the chuck is controlled to make the temperature of the wafer fall within a temperature range.