| 摘要 |
Method for encapsulation of an electronic microcircuit (1) for production of an electronic module which may be fixed by simple gluing or soldering. Said microcircuit has a geometrical form that matches a card (19) housing that is provided to enclose it and has masking means (7) corresponding to the card. The mask prevents bleeding of a coating resin (14) used to protect a chip on such a module. The mask is glued to a support (2) with a contact pad (4) on a first face (3) and the mask and chip on a second face (6). The mask has a window (9) to fix the placing of the chip. The invention also relates to a corresponding method for encapsulation of an electronic microcircuit. |
