发明名称 SOL-LIKE THERMOPLASTIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a sol-like thermoplastic resin composition which has the same storage performance as a polyvinyl chloride base resin sol, is capable of rotational molding at a low temperature of less than or equal to 220°C, has excellent room-temperature fluidity and molten resin fluidity, and hardly suffers from changes with time at room temperature. SOLUTION: The sol-like thermoplastic resin composition comprises (a) 100 pts.wt. of a water-based solvent, (b) 0.1-30 pts.wt. of a surfactant, and 5-250 pts.wt. of a polyolefin based resin having the following upper and lower limits of particle diameters. The lower limit is: 90% mean particle diameter of 41μm, and the upper limit is: 1.651 mm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008223040(A) 申请公布日期 2008.09.25
申请号 JP20080150437 申请日期 2008.06.09
申请人 RIKEN TECHNOS CORP 发明人 TASAKA MICHIHISA
分类号 C08L23/00;C09D5/00;C09D7/12;C09D123/02;C09D201/00 主分类号 C08L23/00
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