| 摘要 |
PURPOSE: Provided is a residue removing composition for a photosensitive etching-resistant layer which effectively removes the organometallic or metal oxide residue modified by the by-product from an under metal layer without damaging the under layer, shows a stable removing property owing to a low volatility and is reduced in the toxicity to the human body. CONSTITUTION: The residue removing composition comprises 1-10 wt% of at least one selected from the group consisting of tartaric acid, citraconic acid, citraconic anhydride, maleic acid, maleic anhydride and fumaric acid; 58.99-89 wt% of a polar organic solvent; 9.99-30 wt% of deionized water; and 0.01-1 wt% of an acid selected from the group consisting of oxalic acid and an inorganic acid. Preferably the polar organic solvent is one or two water-soluble organic solvent selected from the group consisting of methyl carbitol, ethyl carbitol, butyl carbitol, dimethyl carbitol and dibutyl carbitol; and the inorganic acid is at least one selected from the group consisting of sulfuric acid and perchloric acid.
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