| 摘要 |
PROBLEM TO BE SOLVED: To prevent, by obtaining a conductive resin composition mixed with mica which is freed from the mica falling off during and after its manufacture, the production line and other products from being contaminated and at the same time to obtain a conductive resin molding having good conductivity, moldability, rigidity, and heat resistance. SOLUTION: The conductive resin composition contains 40-79 wt.% of a polypropylene (A), 1-20 wt.% of a polypropylene grafted with maleic anhydride (B), 10-25 wt.% of carbon black (C), and 10-50 wt.% of mica (D). The molding is obtained by using it. COPYRIGHT: (C)2005,JPO&NCIPI
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