Low-temperature etching environment

摘要

A low-temperature etching environment comprising a halogen and an inert gas in a ratio that does not induce the formation of an etch-limiting surface reaction layer during etching in the low-temperature etching environment. The surface temperature of a material being etched in the low-temperature environment is below that which would melt a photoresist material that has not been treated to increase its glass-reflow temperature.