发明名称 Semiconductor device with capacitor
摘要 A pointed shape may be present on the top end of the capacitor bottom (lower) electrode of a cylindrical capacitor. To cover this pointed end, a two-layer dielectric film of a capacitor dielectric film and another capacitor dielectric film is formed. As a result, while the capacitor bottom electrode has a pointed shape on its top end, the dielectric film covering the portion having a pointed shape has a greater thickness than the dielectric film covering the other parts of the vertical portion. Thus, even if the portion with a pointed shape on the capacitor bottom electrode has a concentration of electric field, the dielectric film exhibits a sufficient insulation performance to prevent leakage current. In this way, a semiconductor device is provided with an improved property of a capacitor dielectric film by the reduction of the risk of generating a leakage current in the capacitor dielectric film.
申请公布号 US2004229427(A1) 申请公布日期 2004.11.18
申请号 US20030690571 申请日期 2003.10.23
申请人 RENESAS TECHNOLOGY CORP. 发明人 WAKAO KAZUTOSHI;TSUCHIMOTO JUNICHI;INABA YUTAKA;AIHARA KAZUHIRO
分类号 H01L21/8242;H01L21/02;H01L21/8234;H01L27/108;(IPC1-7):H01L21/823 主分类号 H01L21/8242
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