| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of inspecting a stacked ceramic element and a method of manufacturing a stacked ceramic component which can calculate the defect size of a minute internal defect with high precision. SOLUTION: A high-frequency wave is focused on a position which is at a predetermined distance from the surface having surface roughness Ra not larger than 2μm of the stacked ceramic element, which has a conductive layer therewithin and a porus ratio not more than 5%, with a probe of frequency not lower than 50MHz, and is incident on the device so that the incident angle is nearly perpendicular to the surface. A defect echo having a height not lower than 5% of that of a standard echo is extracted, wherein the standard echo is obtained when the high-frequency wave is focused on an artificial defect in a standard sample having the artificial defect. Based on a defect size D1 calculated from the defect echo and the relationship between the defect size of the artificial defect obtained from the standard echo and the defect size of the actual artificial defect, a defect size D2 actually present within the stacked ceramic element is calculated. COPYRIGHT: (C)2005,JPO&NCIPI
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