Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing carrier substrate, semiconductor device, and electronic device

摘要

A technique is provided to reduce variations in height of packages even when any one of the packages is warped. According to the technique, the thicknesses of lands disposed on a carrier substrate gradually increase from the inner region to the outer region of the carrier substrate. The thicknesses of lands disposed on opposite carrier substrates gradually increase from the inner region to the outer region.