| 摘要 |
PROBLEM TO BE SOLVED: To produce a high quality printed wiring board in which high positional accuracy is ensured and exudation of adhesive is suppressed. SOLUTION: When a printed wiring board is produced by pasting a wiring board 4 and a cover lay film 5, the wiring board 4 obtained by forming a circuit 3 on the surface of a base substrate 1 and the cover lay film 5 provided with an adhesive layer 6 are laid in layer while being aligned to produce a sheet 10. Such a part in the sheet 10 as requiring high positional accuracy or requiring to suppress the exudation of adhesive is hot pressed previously in primary pressing process and the remaining part is hot pressed in secondary pressing process. The entire sheet is hot pressed stepwise thus pasting the wiring board 4 and the cover lay film 5. COPYRIGHT: (C)2005,JPO&NCIPI
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