| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic wiring board capable of mass producing an AlN substrate by forming a metal circuit board on a substrate and then dividing it, although the metal circuit board was conventionally formed only for each single surface. SOLUTION: (A) An AlN substrate of width 25 mm×length 100mm×thickness 0.635mm, having a flexural strength 41kgf/mm<SP>2</SP>, with division lines (depth of 0.15mm) is prepared. (B) A bonding paste in which eutectic composition of Ag-Cu is added with Ti by 4 wt.% is applied on the substrate, and a copper plate is laminated on the paste, which is thermally processed for jointing the copper plate. (C) The resulting copper plate, a joint body, is etched in a ferric chloride solution to remove an unnecessary part of copper, forming a copper circuit. (D) The resulting substrate is pressurized with a human hand to split the substrate along the division line. COPYRIGHT: (C)2005,JPO&NCIPI
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