| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of cracks when a sample is collected from a cut rod without subjecting the rod to heat treatment. SOLUTION: The cut rod 1 is sampled from a polycrystalline silicon rod manufactured by a Siemens method. At one or a plurality of positions of the cut rod 1 in its circumferential direction, one or more slits 2 extending from the circumferential surface toward the central part of the cut rod 1 are formed over the whole length of the cut rod 1. The residual stress in the circumferential direction is released when the slit 2 is formed, and even when a stress is added by sampling, the stress is released by deformation of the cut faces, because the cut faces at both sides, putting the slit 2 between them, becomes free interfaces. Consequently, the occurrence of cracks during sampling can be suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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