发明名称 LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a laminate for a circuit board having excellent dimensional stability by a simple manufacturing method, by using a thermoplastic resin which is capable of forming an optically anisotropic melting phase. SOLUTION: This laminate for the circuit board is manufactured by a method wherein the thermoplastic resin melted by heating and capable of forming the optically anisotropic melting phase is cast on a metal foil and heated further at the melting point of the thermoplastic resin or above. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004322523(A) 申请公布日期 2004.11.18
申请号 JP20030121759 申请日期 2003.04.25
申请人 MITSUBISHI PAPER MILLS LTD 发明人 AIZAWA WAKANA;HYODO KENJI
分类号 B32B15/08;(IPC1-7):B32B15/08 主分类号 B32B15/08
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