| 摘要 |
<p>PURPOSE:To prevent the mutual contact of each lead pair by a method wherein a pair of leads are formed at the symmetrical positions of both ends while being vertically bent to the surface of a chip, a connecting plate is spanned crossing the leads and connection with the outside is facilitated, and each lead pair is arranged in parallel. CONSTITUTION:A pair of the electrode leads 12a, 12b are erected at the symmetrical positions of both ends to the main surface of the semiconductor chip 11, the leads 13a, 13b are mounted similarly, and straight lines connecting the terminals of each pair are mutually disposed in parallel. A small wire is used as a lead 14 for a control electrode in accordance with a conventional method. The connectng plates 12e, 13e are laid over the leads 12a-12b, 13a-13b and one ends are connected to printing conductors 16a, 16b on a substrate 15, and the lead 14 is connected to a conductor 16c. The other ends 12d, 13d are connected to external power supplies or load or the like. According to this constitution, the connecting plates run parallel mutually and do not contact each other, and forced stress does not apply to the semiconductor chip.</p> |
