发明名称 |
Stacked semiconductor package |
摘要 |
A stacked semiconductor package comprises two semiconductor chips (11, 12) each of which has a mounting surface provided with a plurality of chip pins arranged in a predetermined pattern. The semiconductor chips are mounted on opposite surfaces of a substrate (13) so that the mounting surfaces are faced to each other through the substrate. The substrate is provided with a plurality of package pins formed in an area other than a chip mounting area and arranged in a pattern identical to the predetermined pattern. A pair of the corresponding chip pins of the semiconductor chips are connected to a via formed at an intermediate position therebetween by the use of branch wires equal in length to each other. The via is connected by a common wire to the package pin corresponding to the chip pins connected to the via.
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申请公布号 |
US2004227222(A1) |
申请公布日期 |
2004.11.18 |
申请号 |
US20040787127 |
申请日期 |
2004.02.27 |
申请人 |
ELPIDA MEMORY, INC |
发明人 |
KIKUCHI WATARU;SUGANO TOSHIO;ISA SATOSHI |
分类号 |
H01L25/18;H01L23/538;H01L25/065;H01L25/07;H01L25/10;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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