发明名称 PHOTOSENSITIVE COMPOSITION FOR NEAR-INFRARED LASER EXPOSURE, NEGATIVE IMAGE FORMING MATERIAL USING THE SAME AND IMAGE FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition for near-infrared laser exposure which has high sensitivity to laser light in the infrared region and loses its photosensitivity upon long-time exposure to a white light, and to provide an image forming material using the photosensitive composition and an image forming method. <P>SOLUTION: The photosensitive composition for near-infrared laser exposure satisfies S<SB>2</SB>/S<SB>1</SB>&ge;2 between a minimum light exposure S<SB>1</SB>required to perform image formation by exposure with a near-infrared laser and a minimum light exposure S<SB>2</SB>required to perform image formation by exposure with a near-infrared laser after irradiation with light of 400 lx for 120 min. The photosensitive composition for near-infrared laser exposure contains (A) an epoxy acrylate resin, (B) an infrared absorbing dye having its absorption maximum at a wavelength of 650-1,300 nm and (C) a halomethyl-group-containing compound. The negative image forming material is obtained by forming a photosensitive layer comprising the photosensitive composition for near-infrared laser exposure on a support. In the image forming method, the image forming material is subjected to scanning exposure with a near-infrared laser light source and developed with an alkali developing solution. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004325580(A) 申请公布日期 2004.11.18
申请号 JP20030117193 申请日期 2003.04.22
申请人 MITSUBISHI CHEMICALS CORP 发明人 URANO TOSHIYOSHI;MIZUHO YUUJI
分类号 G03F7/027;G03F7/00;G03F7/004 主分类号 G03F7/027
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