Cooling fin with clip for power semiconductor

摘要

The method involves connecting at least one cooling plate (1) to at least two active semiconductor devices (4) which are mounted vertically on a circuit board (3) and whose large surfaces (2) lie in different planes. The cooling plate (1) and a respective surface of the semiconductor are pressed together in a planar manner by the spring force of a clamp (5). The connection is made using only one clamp (5) that has holder sections (6) each for one of the semiconductor devices and a connector section (7) between the holder sections. The connector section may be set back relative to the end of the holder section nearest the circuit board (3).