| 发明名称 |
Method of characterising a process step and device manufacturing method |
| 摘要 |
A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. The distortion in the substrate wafer is measured after each exposure and processing step by comparing the position of a plurality of reference marks 20 to values in a database. <IMAGE>
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| 申请公布号 |
EP1477857(A1) |
申请公布日期 |
2004.11.17 |
| 申请号 |
EP20040252717 |
申请日期 |
2004.05.11 |
| 申请人 |
ASML NETHERLANDS B.V. |
发明人 |
REUHMAN-HUISKEN, MARIA ELISABETH;DE MOL, CHRISTIANUS GERARDUS MARIA;TOLSMA, HOITE PIETER THEODOOR |
| 分类号 |
G03F7/20;G03F9/00;(IPC1-7):G03F7/20 |
主分类号 |
G03F7/20 |
| 代理机构 |
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