| 摘要 |
PURPOSE: A method is provided to simplify procedures and achieve improved strength of joint and quality of printed circuit board. CONSTITUTION: A method comprises a step of cutting and removing defective printed circuit board from a printed circuit board sheet(100) constituted by a plurality of printed circuit boards, in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board are formed into a three-dimensional shape; and a step of bonding a non-defective printed circuit board(120) to the cut surface of the printed circuit board sheet by using an adhesive(130), and hardening the resultant structure. The defective printed circuit board is cut from the printed circuit board sheet in such a manner that the cut surfaces of the printed circuit board sheet and defective printed circuit board have stepped portions.
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