Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex

摘要

Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.