SEMICONDUCTOR DEVICE HAVING MOUNTING SUBSTRATE WITH STEPPED PORTION AND MANUFACTURING METHOD THEREOF TO IMPROVE ADHESION STRENGTH BETWEEN SEALING RESIN AND MOUNTING SUBSTRATE

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve adhesion strength between a sealing resin and a mounting substrate by providing a stepped portion for a periphery of the mounting substrate. CONSTITUTION: A semiconductor device(10) includes a mounting substrate, conductive patterns, a semiconductor chip, and a sealing resin. The mounting substrate(11) includes a stepped portion(15) at its periphery. The conductive patterns(12,16) are formed on a surface of the mounting substrate. The semiconductor chip(13) is attached on the mounting substrate to contact electrically the conductive pattern. The sealing resin(18) is selectively formed on the resultant structure to protect the semiconductor chip.