| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for electric components, even when being pressed by a pedestal surface of a heat sink in a state where an IC package is not stored therein, preventing the pedestal surface from coming into contact with a contact pin.SOLUTION: When a pressing mechanism 31 is lowered toward a socket body side, if an IC package is stored on a floating plate 40, a pedestal surface 36 of a heat sink 32 comes into contact with the IC package. However, when the IC package is not stored on the floating plate 40, a pair of push-up members 33 are lifted up by the floating plate 40 to push up the heat sink 32. Consequently, the heat sink 32 is lifted with respect to a cover member 30 to avoid contact of the pedestal surface 36 of the heat sink 32 with the contact pin.SELECTED DRAWING: Figure 7 |
