Connection terminal fixing method for e.g. modem card, involves depositing two sets of solder studs at level of respective cavity and contact zones, installing electronic components and brazing terminal by reflow of studs

摘要

The method involves introducing a connection terminal head in a wafer cavity, at a level of one face of a printed circuit board. Two sets of solder studs are deposited on another face of the board, at a level of the cavity and at a level of contact zones receiving electronic components, respectively. The components are installed on the latter face and the terminal is brazed by reflow of the studs.