| 发明名称 |
Superjunction device and method of manufacture therefore |
| 摘要 |
A process for forming a superjunction device that includes a series of implants to form closely spaced implant regions which are linked together by a short thermal step, whereby deep and narrow regions can be formed within a semiconductor body.
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| 申请公布号 |
US2004224455(A1) |
申请公布日期 |
2004.11.11 |
| 申请号 |
US20040808049 |
申请日期 |
2004.03.24 |
| 申请人 |
HENSON TIMOTHY;CAO JIANJUN;SPRING KYLE |
发明人 |
HENSON TIMOTHY;CAO JIANJUN;SPRING KYLE |
| 分类号 |
H01L;H01L21/336;H01L29/06;H01L29/10;H01L29/78;H01L31/062;H01L31/113;(IPC1-7):H01L31/062 |
主分类号 |
H01L |
| 代理机构 |
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代理人 |
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