发明名称 |
PACKAGE STRUCTURE AND SENSOR MODULE USING THE SAME |
摘要 |
The present invention relates to a package structure which is formed by coupling a sintered ceramic base substrate to a ceramic frame, and a sensor module using the package structure. The package structure comprises a frame made of ceramic or plastic material, a groove being formed at an end portion of the frame on the sintered ceramic substrate side; one or more sintered ceramic substrates provided with electrodes; and a bonding means made of glass material or organic bonding material, for bonding the sintered ceramic substrate and the frame. |
申请公布号 |
WO2004097940(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
WO2003KR01536 |
申请日期 |
2003.07.30 |
申请人 |
SMATTECH, INC. |
发明人 |
LEE, HYEUNG-GYU;LEE, YOUN-SEOB;SUNWOO, KYUN;JEON, IN-SOO |
分类号 |
H01L27/146;H01L23/00;H01L23/10;H01L31/0203 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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