| 摘要 |
In a saturated polyester resin or a composition with the saturated polyester resin as the main component for molding, the melt viscosity at 200° C. is at least 5 dPa.s and not more than 1000 dPa.s, and the product axb is at least 500 where a (N/cm<2>) is the tensile breaking strength and b (%) is the tensile breaking elongation of a film shape formed product. Preferably, the polyester resin has a glass transition temperature of not more than -10° C., a melting point of at least 70° C. and not more than 200° C., and an ester group concentration of at least 1000 equivalents/10<6 >g and not more than 8000 equivalents/10<6 >g. A material superior in water resistance, electrical insulation, durability, working environment and productivity as a molding material for an electric electronic component having a sophisticated configuration is provided.
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