| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a recording device which can effectively release heat generated by driving elements on a flexible wiring board. <P>SOLUTION: A heat sink 27 for radiating the heat generated from IC chips 35-38 which drive a recording head into the air is extended between a back wall 18b of a head holder 18 and a circuit board 26. Therefore, as compared with the conventional one, the heat sink 27 can be increased in the area and can be enhanced in the heat radiation effect. Moreover, a recess for avoiding legs of electronic components soldered to the circuit board 26 is formed at an opposed face to the circuit board 26 of the heat sink 27. The heat sink 27 is separated by a predetermined distance from each of the back wall 18b of the head holder 18 and the circuit board 26, so that the radiation of heat from the heat sink 27 is prevented from being obstructed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
