发明名称 THERMALLY CONDUCTIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive composition having high thermally conductive performance with thermally conductive microparticles dispersed homogeneously despite containing a large amount thereof, and having viscosity not getting extremely high. SOLUTION: The thermally conductive composition is characterized in that a polyglycerol fatty acid ester-based dispersant and the thermally conductive microparticles are included in a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004315638(A) 申请公布日期 2004.11.11
申请号 JP20030110691 申请日期 2003.04.15
申请人 SEKISUI CHEM CO LTD 发明人 HASEGAWA ATSUSHI;AZUMA KENICHI;HYOZU SHUNJI
分类号 C08L101/00;C08K3/20;C08K3/28;C08K3/38;(IPC1-7):C08L101/00 主分类号 C08L101/00
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