发明名称 |
THERMALLY CONDUCTIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive composition having high thermally conductive performance with thermally conductive microparticles dispersed homogeneously despite containing a large amount thereof, and having viscosity not getting extremely high. SOLUTION: The thermally conductive composition is characterized in that a polyglycerol fatty acid ester-based dispersant and the thermally conductive microparticles are included in a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004315638(A) |
申请公布日期 |
2004.11.11 |
申请号 |
JP20030110691 |
申请日期 |
2003.04.15 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
HASEGAWA ATSUSHI;AZUMA KENICHI;HYOZU SHUNJI |
分类号 |
C08L101/00;C08K3/20;C08K3/28;C08K3/38;(IPC1-7):C08L101/00 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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