| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin-film resistor element capable of controlling occurrence of cracks in a thin film resistor due to repeated heat generation and cooling, caused by intermittent current carrying of the thin-film resistor formed on a substrate. <P>SOLUTION: This thin-film resistor element is provided with the substrate that supports a first and a second contacts. On the substrate, a compliant material is deposited. The thin-film resistor is deposited on the compliant material and combined between the primary and second contacts. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
