发明名称 ELECTROCONDUCTIVE COPPER PASTE, ELECTROCONDUCTIVE COPPER PASTE HARDENED FILM, AND SEMICONDUCTOR DEVICE
摘要 The purpose of the present invention is to provide an electroconductive copper paste that can be hardened in an air atmosphere, the pot life being long, the specific resistance being low even when under high-temperature short-duration hardening conditions, and the specific resistance after hardening not varying greatly according to the copper powder content. An electroconductive copper paste characterized in containing (A) a copper powder, (B) a thermoset resin, (C) a fatty acid in liquid form at room temperature, and (D) triethanolamine. Component (B) is preferably a resol-type phenolic resin and, more preferably, component (B) is present in an amount of 10-20 mass parts per 100 mass parts in total of components (A) and (B).
申请公布号 WO2016140185(A1) 申请公布日期 2016.09.09
申请号 WO2016JP56042 申请日期 2016.02.29
申请人 NAMICS CORPORATION 发明人 KAJITA Masashi;SAKAMOTO Takashi;KONNO Shigeko;TAKAHASHI Tomoyuki
分类号 H01B1/22;H01B5/14;H01B13/00;H01L21/60;H05K3/32 主分类号 H01B1/22
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